Canada-ASEAN Scholarships and Educational Exchanges for Development: Applications Open

The Canada-ASEAN Scholarships and Educational Exchanges for Development (SEED) program provides opportunities for students from ASEAN member states to conduct short-term study or research in Canadian post-secondary institutions in areas that contribute to the implementation of the 2030 Agenda for Sustainable Development.

UMAP Canadian higher education institutions who are members of the University Mobility in Asia and the Pacific (UMAP) consortium can leverage their membership to attract student applicants from UMAP member institutions across the Asia Pacific region. The UMAP Pledge of Agreement serves as proof for institutional agreements with higher education institutions belonging to the UMAP network.

This provides a significant advantage to UMAP Canada member institutions to expand their institutional partnerships to new countries or regions and apply for the Global Affairs Canada scholarships. UMAP’s focus on cross-border academic collaboration and its commitment to promoting student mobility align seamlessly with the goals of the ASEAN-SEED scholarship program.

UMAP Canada member institution Memorial University shares their success story in leveraging these scholarship programs through their UMAP membership:

“Memorial University is privileged to be able to utilize its affiliation with UMAP to welcome for the first-time students from Universiti Brunei Darussalam under the Government of Canada’s Canada-ASEAN Scholarships and Educational Exchanges for Development (SEED) program. This synergy helps in strengthening our institutional partnership while assisting these students as they explore this wonderful opportunity to achieve their educational goals.” Chris Hibbs, Manager of International Partnerships, Memorial University of Newfoundland & Labrador.

If you are interested in joining UMAP or have any questions, please contact UMAP Canada at umap@bccie.bc.ca.

SEED applications are open now and will close on March 21, 2024.

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